Laboratory for Testing Electronic Products
We conduct research on the components of assembly and disassembly technologies for electronic assemblies, develop new applications integrating various technologies, and carry out research in the field of validation of electronic assemblies and products.
The work carried out includes the development of new solutions for assembly substrates, materials and technologies for joining electronic components into assemblies. Research is also conducted on assembly technologies of electronic assemblies affecting their quality and reliability.
We conduct research on the components of technologies for the assembly and disassembly of electronic assemblies, develop new applications integrating various technologies, and perform research on the validation of electronic assemblies and products.
Other tests are performed outside the scope of accreditation.
The Electronic Products Testing Laboratory holds an Accreditation Certificate granted by the Polish Centre for Accreditation (AB045).
Scope of laboratory activities:
- functional testing,
- climatic exposure tests,
- mechanical exposure tests,
- electromagnetic compatibility (EMC),
- safety-of-use testing of selected electronic products,
- testing of printed circuit boards before and after assembly.
Non-destructive testing:
- ionic cleanliness analysis of electronic assemblies,
- compliance analysis with the RoHS 2 Directive (XRF screening method),
- coating thickness analysis using the XRF method,
- X-ray testing, including laminography and CT,
- SEM-EDX testing,
- spectroscopic testing.
Destructive testing:
- metallographic cross-sections of printed circuit boards, solder joints, and electronic components,
- solderability testing of components using the meniscograph method,
- solderability testing of printed circuit boards.
- thermal shock resistance and delamination,
- climatic testing.
Contact:
Marek Kościelski
Kierownik Laboratorium
tel. +48 22 590 73 55
marek.koscielski@itr.lukasiewicz.gov.pl
