Project title
Experimental technology for embedding resistive and capacitive elements inside a printed circuit board
Legal basis
Agreement no. UDA-POIG.01.03.01-14-031/08-00 between the Implementing Authority – Information Processing Center and Tele and Radio Research Institute
Implementation date: 2007 r. – 2013 r.
The project is implemented under the Innovative Economy Operational Programme, 2007-2013, Priority 1 Research and Development of Modern Technologies, Measure 1.3 Support for R&D Projects for Entrepreneurs carried out by Scientific Units, Sub-measure 1.3.1 Development Projects
Source of funding
The project is co-financed by the European Union from the European Regional Development Fund and the state budget.
Project Objective
The project is a continuation of the activities undertaken at ITR related to innovative technologies for making multilayer printed circuit boards with internal micro-connections and the Institute’s strategy aimed at implementing the results of research work in electronics sector enterprises. The project is aimed at the socio-economic needs of small and medium-sized enterprises (SMEs) in the electronics sector, which, in order to stay in the market, should constantly increase the level of innovation of their production while reducing the cost of manufacturing products. The project addresses the need of SMEs for the knowledge necessary to select a technology tailored to their individual needs or those of their customers.
The project has been completed. Bid for sale of work results and licensing.
Tele and Radio Research Institute completed on 10.04.2012 the implementation of the project No. UDA-POIG.01.03.01-14-1031/08-05 titled: “Experimental technology for incorporation of resistive and capacitive elements inside a printed circuit board” carried out under the Operational Program Innovative Economy, 2007-2013, Priority 1 Research and Development of Modern Technologies, Measure 1.3 Support for R&D Projects for entrepreneurs carried out by scientific units, Sub-measure 1.3.1.
During the project, research and experimental trials were carried out, resulting in the development of a new comprehensive technological solution, from the development of processes for molding an individual planar passive component, to the final product, which is a model of a multilayer printed circuit board with passive components embedded inside, and a model of electronic circuits built using printed circuit boards with embedded components.
Model boards made under the developed technologies were tested under mechanical and climatic exposures and checked on an electronic assembly experimental line under lead-free soldering conditions.
The result of the project is the developed experimental technology for embedding thin- and thick-film resistive and capacitive elements inside a printed circuit board, as well as the knowledge base of materials with suitable properties for forming resistive (thin- and thick-film) and capacitive elements for embedding inside a multilayer printed circuit board, the principles of construction and design of embedded elements and their non-defectiveness.
The developed technological solution for manufacturing a new generation of printed circuit boards with high component packing density is an important addition to existing PCB manufacturing technologies and enables the implementation of a highly advanced way of miniaturizing electronic products that increases the functionality of electronic devices.
Small and medium-sized companies are cordially invited to learn about the project’s results and cooperate in their commercial exploitation. The results of the project are intended to be made available and implemented under market rights to modernizing domestic printed circuit board manufacturing enterprises, electronic assembly enterprises and electronic device manufacturing enterprises.
We offer sales to companies providing electronic assembly services and electronic equipment manufacturers using the latest types of integrated circuits in their projects:
- Guidelines on the principles of construction and design of thin-film resistors for incorporation inside a multilayer printed circuit board.
- Guidelines on the principles of construction and design of thick-film resistors, along with the ranges of resistance changes occurring at each stage of manufacturing a multilayer printed circuit board and how to correct this resistance to the assumed resistance.
- Guidelines on the principles of construction and design of planar capacitors using a base material in the form of a laminate with a thin dielectric layer and using internal micro-joints.
- Guidelines and conditions to form resistors and capacitors using a new generation of thin laminate consisting of a resistive layer and a capacitive layer.
- Guidelines for designing multilayer printed circuit boards with embedded passive components.
- Resistor correction methods using laser ablation.
We offer manufacturers of multilayer boards to grant a non-exclusive license to implement the developed technologies for manufacturing printed circuit boards with embedded resistive and capacitive components.