Multifunctional aluminum-based housing for electronic devices in a closed-loop economy

Project Objective:

The project aims to facilitate the design of electronic products so that they are optimized in terms of energy and materials throughout the product life cycle, especially for recycling. This research project will adapt existing MID technologies for creating electronic circuits and antennas to an aluminum-based product housing concept for ICT equipment. Recycling aluminum and using recycled aluminum is an excellent contribution to the goals of the circular economy in line with the European Commission’s Green Deal program. First estimates show that an aluminum enclosure is more environmentally sustainable than a comparable enclosure made of plastic.

The use of aluminum in small network devices such as WLAN routers or 5G radio stations serves a primary purpose:

1. Aluminum is mainly used as a housing material with dual functionality as a heat sink for the electronic assembly. This eliminates the need for active fans in combination with heat sinks and plastic housing.
2. Aluminum acts as a carrier for printed circuits, electronic components, and especially planar antennas. This material concept makes the ICT product very compact. It will also reduce the environmentally problematic use of plastics and composites, which are typically used for this purpose.

Due to the new circular economy concept that underpins the project, a chain of markets and relevant industries will benefit from such a project. The project ranges from the upstream market of the aluminum and foundry industry, to the production of electronic parts and devices, to the processing and recycling of electronic waste. With new manufacturing technologies and eco-design approaches, the project could find a wide range of applications in the electronics and ICT market, such as set-top-boxes and industrial computers.

Specifically, the project will demonstrate to SMEs how resource-saving eco-design can be practically integrated into early technology and product development, considering the entire product life cycle. It will also demonstrate approaches to “design for recycling” and “design with recycled materials.”

The project implements innovative manufacturing and recycling technologies for an efficient circular economy. It demonstrates how the carbon footprint can be calculated and reduced through a novel, multifunctional housing concept. The ultimate goal of the project is to close the aluminum-based material cycle without losing more valuable rare and precious materials (gold, palladium, tungsten, etc.) from electronic components on the circuit board.

All information about the project will be provided:

Marek Koscielski

tel: (22) 590-73-55

e-mail: marek.koscielski@itr.lukasiewicz.gov.pl

(national consortium: KIGEiT, Łukasiewicz-ITR, Łukasiewicz-IMN)

(European consortium: 3D MID e-V. – Germany, KIGEIT – Poland, FhG IEM – Germany, FhG IZM – Germany, Łukasiewicz-ITR – Poland, Łukasiewicz-IMN – Poland