We develop new materials, printed circuit boards, assembly technologies and electronic applications that are implemented in enterprises of the electronics industry.
These include, among others:
- specialized printed circuit boards with embedded components,
- environmentally friendly materials and technologies for the assembly of electronic components,
- nanomaterials for use in sensors as well as in pastes and inks for the production of printed electronics,
- technologies for printing elements of printed electronics.
Łukasiewicz – ITR also carries out research work for companies in the field of:
- development of new printed circuit board solutions,
- validation of materials,
- components,
- products and technological processes for the assembly of electronic assemblies,
- research related to solving technological problems encountered in assembly and soldering processes of electronic equipment.
Testing of electronic systems
Łukasiewicz – ITR conducts:
- research on component elements of technologies for assembly and disassembly of electronic assemblies,
- development of new applications integrating various technologies,
- research in the field of validation of electronic assemblies and products.
The work carried out includes the development of new solutions for assembly substrates, materials and technologies for joining electronic components into assemblies. Research is also conducted on assembly technologies of electronic assemblies affecting their quality and reliability.
The areas of research also include:
- issues of RFID technology, printed, flexible and organic electronics,
- issues of thermal management in electronic assemblies,
- reliability of assemblies for special-purpose and space applications.
The Department is also engaged in research and solving atypical technological problems occurring in electronics assembly plants, and examines the possibilities of application of electronic products in various sectors of the economy.
Part of the research is carried out by the Laboratory for Quality Testing and Calibration of Electronic Products (Accreditation AB045), which conducts accredited tests of printed circuit boards, printed electronics elements, climatic and reliability testing of electronic assemblies, as well as IPC, X-ray, SEM analyses, and assessment of the quality and reliability of soldered joints.
Testing of electronic systems
The research activity of the Department of Electronic Assembly Technology is focused on the practical needs of manufacturers of electronic equipment for various sectors of the economy.
Since 1999, the Department has been carrying out research work related to the implementation of lead-free SMT assembly technology, including adapting production to changing environmental requirements (RoHS). Research also includes assembly technologies using silver soldering materials: pastes, adhesives, fluxes, and combinations of these materials for connecting electronic components on various types of printed circuit boards. The Department conducts research on assembly technologies of various electronic components, including miniaturized components, CSPs, non-housed structures, through-hole and surface-mount components (THT and SMT), as well as elements in COB and COF solutions. In recent years, the Department has also carried out research on assembly technologies of 3D structures based on PoP and PiP systems, as well as research on the assembly of electronic assemblies for special-purpose applications, including space applications.
Printed circuits
Łukasiewicz – Tele and Radio Research Institute has been conducting research and service activities in the field of electronic technologies for over 60 years. One of the most important investments carried out by Łukasiewicz–ITR in the years 2018–2021 was the comprehensive modernization of the Printed Circuit Board Department, which resulted in modern technological equipment. Precision printed circuits manufactured by us are used both in standard designs and in the medical, energy, military, and space industries.
We manufacture all types of printed circuit boards:
- rigid, rigid-flex and flexible,
- single-sided, double-sided and multilayer,
- single-sided, double-sided and multilayer,
- boards on laminates for high-frequency applications,
- hybrid constructions.
As the only entity in Poland, we manufacture boards using HDI technology (high-density interconnect):
- blind vias with a diameter from 0.1 mm,
- buried vias with a diameter of 0.15 mm,
- otwory przelotowe od średnicy 0,2 mm
- through vias with a diameter from 0.2 mm.S
- signal lines with controlled impedance
We manufacture custom printed circuit boards:
- antennas with composite structures
- with copper radiators on internal layers
- circuits based on resistive Inconel 600 material
- passive components manufactured using thin- and thick-film technology
We offer short lead times:
- płytki jednostronne od 24 godzin
- single-sided boards within 24 hours
- double-sided boards within 48 hours
- multilayer boards from 3 business days
We have extensive experience in processing various materials. We use:
- standard laminates (FR4), including those from Isola, NanYa
- laminates for high-frequency applications up to 10 GHz, FR408 type (Isola)
- laminates for microwave circuits (Rogers)
- flexible laminates (DuPont, Krempel) and others
- others according to customer requirements
Our technologists provide technical support at all stages of project development:
- support in designing boards with signal integrity
- support in designing boards using HDI technology
- assessment of manufacturability of board designs
At the customer’s request, we prepare designs based on schematics.
Learn more:
Please send inquiries to:
Adam Lipiec
Senior Specialist for Production Preparation
Printed Circuit Board Department
Wojciech Stęplewski
Research Group Leader for Printed Circuit Board and Assembly Technologies
Marek Kościelski
Head of the Laboratory for Testing of Electronic Products