{"id":53737,"date":"2025-07-14T13:41:44","date_gmt":"2025-07-14T11:41:44","guid":{"rendered":"https:\/\/itr.lukasiewicz.gov.pl\/laboratory-for-testing-electronic-products\/"},"modified":"2026-02-05T14:55:36","modified_gmt":"2026-02-05T13:55:36","slug":"laboratory-for-testing-electronic-products","status":"publish","type":"page","link":"https:\/\/itr.lukasiewicz.gov.pl\/en\/laboratory-for-testing-electronic-products\/","title":{"rendered":"Laboratory for Testing Electronic Products"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"53737\" class=\"elementor elementor-53737 elementor-48107\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b11ebcb e-flex e-con-boxed e-con e-parent\" data-id=\"b11ebcb\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-7e7ce39 e-con-full e-flex e-con e-child\" data-id=\"7e7ce39\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4713bb9 elementor-widget elementor-widget-heading\" data-id=\"4713bb9\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">Laboratory for Testing Electronic Products<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6aacb8a elementor-widget elementor-widget-text-editor\" data-id=\"6aacb8a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>We conduct research on the components of assembly and disassembly technologies for electronic assemblies, develop new applications integrating various technologies, and carry out research in the field of validation of electronic assemblies and products.<\/p><p>The work carried out includes the development of new solutions for assembly substrates, materials and technologies for joining electronic components into assemblies. Research is also conducted on assembly technologies of electronic assemblies affecting their quality and reliability. <\/p><p>We conduct research on the components of technologies for the assembly and disassembly of electronic assemblies, develop new applications integrating various technologies, and perform research on the validation of electronic assemblies and products.<\/p><p>Other tests are performed outside the scope of accreditation.<\/p><p>The Electronic Products Testing Laboratory holds an Accreditation Certificate granted by the Polish Centre for Accreditation (AB045).<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f4333fc e-con-full e-flex e-con e-child\" data-id=\"f4333fc\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-27a2e21 e-con-full e-flex e-con e-child\" data-id=\"27a2e21\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-2b82a4c elementor-widget elementor-widget-heading\" data-id=\"2b82a4c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Scope of laboratory activities:<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d3790bb elementor-widget elementor-widget-text-editor\" data-id=\"d3790bb\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul><li>functional testing,<\/li><li>climatic exposure tests,<\/li><li>mechanical exposure tests,<\/li><li>electromagnetic compatibility (EMC),<\/li><li>safety-of-use testing of selected electronic products,<\/li><li>testing of printed circuit boards before and after assembly.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4b502f6 elementor-widget elementor-widget-heading\" data-id=\"4b502f6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Non-destructive testing:<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-61726df elementor-widget elementor-widget-text-editor\" data-id=\"61726df\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul><li>ionic cleanliness analysis of electronic assemblies,<\/li><li>compliance analysis with the RoHS 2 Directive (XRF screening method),<\/li><li>coating thickness analysis using the XRF method,<\/li><li>X-ray testing, including laminography and CT,<\/li><li>SEM-EDX testing,<\/li><li>spectroscopic testing.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-11ea847 elementor-widget elementor-widget-heading\" data-id=\"11ea847\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Destructive testing:<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-14dc64c elementor-widget elementor-widget-text-editor\" data-id=\"14dc64c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul><li>metallographic cross-sections of printed circuit boards, solder joints, and electronic components,<\/li><li>solderability testing of components using the meniscograph method,<\/li><li>solderability testing of printed circuit boards.<br><\/li><li>thermal shock resistance and delamination,<\/li><li>climatic testing.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0594400 elementor-widget elementor-widget-heading\" data-id=\"0594400\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Contact:<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-2231686 elementor-widget elementor-widget-text-editor\" data-id=\"2231686\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Marek Ko\u015bcielski<br>Kierownik Laboratorium<br>tel. <a href=\"tel:+48%2022%20590%2073%2055\">+48 22 590 73 55<\/a><br><a href=\"mailto:marek.koscielski@itr.lukasiewicz.gov.pl\">marek.koscielski@itr.lukasiewicz.gov.pl<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b2d86ff elementor-widget elementor-widget-gallery\" data-id=\"b2d86ff\" data-element_type=\"widget\" data-e-type=\"widget\" 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The work carried out includes the development of new solutions for assembly substrates, materials and technologies [&hellip;]<\/p>\n","protected":false},"author":208,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_seopress_robots_primary_cat":"","_seopress_titles_title":"","_seopress_titles_desc":"","_seopress_robots_index":"","inline_featured_image":false,"footnotes":""},"class_list":["post-53737","page","type-page","status-publish","hentry"],"acf":[],"publishpress_future_action":{"enabled":false,"date":"2026-04-27 18:51:47","action":"change-status","newStatus":"draft","terms":[],"taxonomy":"translation_priority","extraData":[]},"publishpress_future_workflow_manual_trigger":{"enabledWorkflows":[]},"_links":{"self":[{"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/pages\/53737","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/users\/208"}],"replies":[{"embeddable":true,"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/comments?post=53737"}],"version-history":[{"count":1,"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/pages\/53737\/revisions"}],"predecessor-version":[{"id":53738,"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/pages\/53737\/revisions\/53738"}],"wp:attachment":[{"href":"https:\/\/itr.lukasiewicz.gov.pl\/en\/wp-json\/wp\/v2\/media?parent=53737"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}